|Home|
Contact US|
​招標專區|
  • About Jentech

    • Jentech Introduction
    • Jentech History
    • Company Structure
    • Values and Business Philosophy
    • Tradeshows&Conferences
    • News
  • Core Product

  • Core Technologies

    • Thermal Solution
    • Tooling
    • Stamping
    • Plating
    • Insert Molding
    • Injection Molding
    • Machining
    • Assembly Service
    • Ceramic Substrate
  • Quality Policy

  • Worldwide

  • Investors

    • Monthly Revenue
    • Stock Services
  • Stakeholder Engagement

    • Stakeholder interaction&Business Summary
    • Communication Channels
  • Corporate Social Responsibility

    • Social Participation
  • Careers

    • Join Jentech
    • Compensation and Benefits
    • Training and Development
  • More

    Use tab to navigate through the menu items.
    Thermal Solution
    Tooling
    Stamping
    Plating
    Insert Molding
    Injection Molding
    Machining
    Assembly Service
    Ceramic Substrate

    AlSic Spacer

    TSAPP04.jpg

    The dies of the double side cooled power module are dissipated on the front side by alloy spacers. It has proper thermal conductivity, thermal expansion coefficient and solder ability.