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    Thermal Solution
    Tooling
    Stamping
    Plating
    Insert Molding
    Injection Molding
    Machining
    Assembly Service
    Ceramic Substrate

    Pin Fin Heat Sink

    Pin Fin.jpg

    The IGBT Power module comes with a Pin-Fin baseplate for direct liquid cooling which significantly improves the thermal cycles capability and extends the lifetime. The Pin-Fin baseplate with its excellent cooling properties enables a very high power density of the package.