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Semiconductor Leadframe

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Lead Frame

High precision stamped lead frame

Multiple surface treatment options

  • Ag

  • Ni/ Pd /Au

  • Selective Ni / Pd / Au

  • Ni/ Ni Phosphorus

Pre Molding

PPA/ PCT/ LCP thermal plastic injection molding

EMC thermal set transfer molding

Riveted Parts

Riveted Parts

Heat Sink

  • Stamped Cu heat sink with great heat conduction which

  • is widely accepted by the market.

  • Provide variety material selection.

  • Multiple surface treatment option. (Ag/Ni/Pd/Au)

  • Full plating

  • Selective plating 

Stamped /

Etching copper pattern

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Insulation film

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Stamped heat sink

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Insulated Metal Substrate

  • High precision forging heat sink.

  • Provide variety insulation film.

  • Great electrical insulation and high mechanical strength

Copper Clip

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Copper Clip

Copper Clip is a component used in electronic devices and circuits. It is an essential component for efficient heat dissipation, stable electrical connections, and mechanical stability

 

  • High Electrical Conductivity

  • High Thermal Conductivity

  • Ease of manufacture

  • Customizable

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