Jentech is the global leader in the design and manufacturing of integrated heat spreaders.
IHS Application Architecture
Providing unified thermal stability across the global digital infrastructure, from hyper-scale cloud centers to handheld mobile devices.
Ultra-thin form factors requiring extreme heat dissipation density.
Balancing performance and mobility through optimized copper spreaders.
The core of our engineering legacy. Maximum surface flatness for DIE contact.
High-wattage thermal control for AI and visual computing workloads.
Robust reliability for 24/7 mission-critical data environments.
Engineering Specifications Beyond Industry Standards
Micron-Level Tolerances
Our proprietary stamping and machining processes achieves high precision, ensuring perfect integration with next-generation semiconductor packages.
Surface Flatness
Sub-micron flatness levels achieved through advanced chemical mechanical polishing (CMP) for minimal thermal interface resistance.
Custom Plating Solutions
Nickel, Gold, and Silver plating options for specialized resistance against oxidation and enhanced solderability.
Ni
Au
Ag
Custom
Material Purity
Utilizing 99.99% Oxygen-Free Copper (OFC) to guarantee maximum thermal conductivity and structural integrity under stress.
Jentech Ecosystem
Vertical Manufacturing
Unlike competitors who rely on fragmented supply chains, Jentech maintains absolute control. From the initial sourcing of high-purity copper to in-house tooling design, micron-stamping, and final electro-plating, every step is governed by our rigorous ISO-certified protocols.