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Forge the future of connectivity with Jentech high-performance semiconductor Lead Frame Solutions.

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沖壓/蝕刻銅塊

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絕緣膜

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​沖壓均熱片

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鉚合件

精密鉚合將導線架與均熱片結合

  • 銅均熱片提供良好的熱傳導，市場接受度最高。

  • 依客戶需求提供多種材質選擇。

  • 可提供絕緣金屬板均熱片之選項。

  • 多樣表面處理選擇(銀/鎳/鈀 /金)

    • 全區電鍍

    • 指定區域選鍍

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Pre Molding

  • PPA/ PCT/ LCP 射出成型

  • EMC 移轉注模成型

金屬散熱板

  • 高精度冷鍛均熱片

  • 各類型高熱導絕緣膜Film應用

  • 電氣絕緣佳、機械強度高。

導線架

精密沖壓導線架

多樣表面處理選擇

  • 銀

  • 鎳/鈀 /金

  • 選鍍鎳/鈀 /金

  • 鎳/鎳磷

The Backbone of
AI Compute.

AI INFRASTRUCTURE ENABLER

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High-density leadframes and thermal management systems engineered for the 1000W+ workloads of tomorrow's silicon.

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Au/Ag/Ni

Precision Plating

Our electro-plating process is done in house .We control deposition thickness at the atomic level, ensuring optimal conductivity and corrosion resistance for mission-critical semiconductor components.

Copper Clip

Redefining semiconductor packaging through advanced thermal management and sub-micron dimensional accuracy.

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High Electrical Conductivity

Minimized resistance paths for high-frequency power applications and efficient signal transmission.

High Thermal Conductivity

Critical heat transfer performance for automotive and industrial grade power modules.

Ease of manufacture

Streamlined leadframe integration designed for automated high-speed SMT assembly lines.

The Silicon Interface

Our advanced etched and stamped leadframes serve as the critical bridge between silicon wafers and PCBs. Specializing in high-density BGA, LGA, and QFN architectures that demand absolute dimensional stability under thermal stress.

BGA Frameworks

Ball Grid Array leadframes for high-performance computing clusters.

LGA Solutions

Land Grid Array precision for server-grade socket interfaces.

QFN Packaging

Quad Flat No-lead frames for efficient thermal dissipation.

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