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一站式內部開發的
客製化液冷方案
為高效能運算量身打造
The Rise of AI & HPC
The era of Artificial Intelligence has ushered in a thermal paradox. As chip architectures shrink, power densities are soaring beyond the limits of air-cooled systems.
Today's data centers require a 2x increase in thermal dissipation performance to maintain operational integrity and efficiency. Jentech modules bridge this gap through innovative fluid dynamics and material science.
1000W+
TDP Capability Per Socket
Fully Customized
Application-specific geometry
98%
Heat Capture Efficiency
In-House
End-to-end manufacturing control
日益提升的散熱需求
隨著 AI 晶片需求快速攀升，伺服器運算能力持續提升，導致晶片的熱設計功耗（TDP）幾乎倍增。
傳統氣冷散熱已難以滿足高功耗裝置的需求，使液冷技術逐漸成為更具可行性的解決方案。
液冷散熱解決方案
液冷技術利用液體優異的熱傳導特性，有效帶走運作過程中產生的熱能。
相較於氣冷系統，液冷系統能承受更高的功率密度。
在 AI 伺服器應用中，隨著晶片功耗突破 1000W，液冷系統不僅可降低運作溫度，亦能延長設備使用壽命。
全客製化內部整合解決方案
健策擁有世界級的熱管理團隊，能針對不同熱密度與多熱源環境，提供高效的液冷解決方案。
我們可依客戶需求客製化各類液冷模組，並具備從設計、開發到量產的完整經驗，以滿足各產業多元的散熱性能需求
Advanced Cold Plates
Micro-channel designs optimized for specific hot-spot locations on silicon dies, maximizing turbulent flow for heat extraction.
Reliability
Leak-Free Design
Vacuum brazed assemblies and 100% helium leak testing ensures mission-critical reliability in high-value deployments.
Manifold Design
Customized fluid distribution paths for uniform pressure across multi-rack clusters.
Quick Disconnects
Non-drip, blind-mate couplings for tool-less hot-swapping and maintenance.
Material Science
High-thermal conductivity copper alloys with aerospace-grade nickel plating.