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Fully customized, in-house direct-to-chip liquid cooling systems tailored to optimize your HPC demands.
The Rise of AI & HPC
The era of Artificial Intelligence has ushered in a thermal paradox. As chip architectures shrink, power densities are soaring beyond the limits of air-cooled systems.
Today's data centers require a 2x increase in thermal dissipation performance to maintain operational integrity and efficiency. Jentech modules bridge this gap through innovative fluid dynamics and material science.
1000W+
TDP Capability Per Socket
Fully Customized
Application-specific geometry
98%
Heat Capture Efficiency
In-House
End-to-end manufacturing control
Increased cooling requirements
With the surge in demand for AI chips, server computing power has continuously increased, causing the thermal design power (TDP) of chips to nearly double.
Traditional air cooling solutions can no longer meet the needs of these high-wattage devices, making liquid cooling technology an increasingly viable solution.
Liquid cooled solutions
Liquid cooling technology utilizes the high thermal conductivity of liquids to effectively dissipate generated heat.
Compared to air cooling systems, liquid cooling systems can handle higher power densities.
In AI servers, as chip wattages exceed 1000W, liquid cooling systems not only lower operating temperatures but also extend equipment lifespan.
In house fully customized solutions
Jentech has a world class thermal management team that provides effective liquid cooling solutions for varying thermal densities and multiple heat sources.
We can customize different liquid cooling modules for our clients and possess experience in design, development, and mass production to meet the thermal performance requirements of various industries.
Advanced Cold Plates
Micro-channel designs optimized for specific hot-spot locations on silicon dies, maximizing turbulent flow for heat extraction.
Reliability
Leak-Free Design
Vacuum brazed assemblies and 100% helium leak testing ensures mission-critical reliability in high-value deployments.
Manifold Design
Customized fluid distribution paths for uniform pressure across multi-rack clusters.
Quick Disconnects
Non-drip, blind-mate couplings for tool-less hot-swapping and maintenance.
Material Science
High-thermal conductivity copper alloys with aerospace-grade nickel plating.