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Forge the future of connectivity with Jentech high-performance semiconductor Lead Frame Solutions.

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Stamped /

Etching copper pattern

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Insulation film

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Stamped heat sink

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Riveted Parts

Heat Sink

  • Stamped Cu heat sink with great heat conduction which

  • is widely accepted by the market.

  • Provide variety material selection.

  • Multiple surface treatment option. (Ag/Ni/Pd/Au)

  • Full plating

  • Selective plating 

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Pre Molding

PPA/ PCT/ LCP thermal plastic injection molding

EMC thermal set transfer molding

Insulated Metal Substrate

  • High precision forging heat sink.

  • Provide variety insulation film.

  • Great electrical insulation and high mechanical strength

Lead Frame

High precision stamped lead frame

Multiple surface treatment options

  • Ag

  • Ni/ Pd /Au

  • Selective Ni / Pd / Au

  • Ni/ Ni Phosphorus

The Backbone of
AI Compute.

AI INFRASTRUCTURE ENABLER

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High-density leadframes and thermal management systems engineered for the 1000W+ workloads of tomorrow's silicon.

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Au/Ag/Ni

Precision Plating

Our electro-plating process is done in house .We control deposition thickness at the atomic level, ensuring optimal conductivity and corrosion resistance for mission-critical semiconductor components.

Copper Clip

Redefining semiconductor packaging through advanced thermal management and sub-micron dimensional accuracy.

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High Electrical Conductivity

Minimized resistance paths for high-frequency power applications and efficient signal transmission.

High Thermal Conductivity

Critical heat transfer performance for automotive and industrial grade power modules.

Ease of manufacture

Streamlined leadframe integration designed for automated high-speed SMT assembly lines.

The Silicon Interface

Our advanced etched and stamped leadframes serve as the critical bridge between silicon wafers and PCBs. Specializing in high-density BGA, LGA, and QFN architectures that demand absolute dimensional stability under thermal stress.

BGA Frameworks

Ball Grid Array leadframes for high-performance computing clusters.

LGA Solutions

Land Grid Array precision for server-grade socket interfaces.

QFN Packaging

Quad Flat No-lead frames for efficient thermal dissipation.

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