top of page
Advancing liquid cooling and uniform heat distribution with next-generation Micro-Channel Lids and Vapor Chamber technology for AI accelerators and HPC clusters.
Engineering Specifications
Technical Advantages
The Jentech Micro-Channel Lid is engineered for the most demanding high-power silicon environments. As AI accelerators and high-performance computing (HPC) chips push thermal envelopes beyond 1000W, our lid technology provides a direct liquid-cooling interface that drastically reduces thermal resistance between the die and the cooling medium.
99.9%
Thermal Continuity
Heat Dissipation Path
Shortened Z-height pathing ensures rapid heat evacuation from hotspot to coolant.
Dense Microchannel Network
Our sub-millimeter channel arrays increase the effective cooling surface area by 400% compared to traditional lid designs.
Material
Oxygen-free copper substrate with specialized gold or nickel plating for maximum preformance.
Mass Production Ready
Liquid-Cooling Architecture
Micro-Channel Lid
The Jentech Micro-Channel Lid is engineered for the most demanding high-power silicon environments. As AI accelerators and high-performance computing (HPC) chips push thermal envelopes beyond 1000W, our lid technology provides a direct liquid-cooling interface that drastically reduces thermal resistance between the die and the cooling medium.
Optimized Flow Dynamics
Proprietary internal channel geometry minimizes pressure drop while maximizing heat transfer surface area.
VC + MC Lid Hybrid Module
A breakthrough in thermal engineering. We have fused the latent heat phase-change capabilities of Vapor Chambers (VC) with the forced convection efficiency of Micro-Channels (MC).
bottom of page