Micro Channel Lid
Microchannel Lid
The Microchannel Lid is a liquid-cooling solution designed for high-power chips and advanced packaging. It features a dense microchannel network, allowing coolant to flow directly over the chip’s hotspots for highly efficient heat dissipation and temperature uniformity. Compared with conventional cold plates and heat spreaders, the Microchannel Lid offers a shorter heat dissipation path, effectively reducing thermal resistance and significantly improving temperature uniformity. It is ideally suited for AI accelerators, HPC processors, 2.5D/3D IC packages, and chiplet integration modules.
Key Features:
-
Designed for high-power liquid cooling
-
Microchannel architecture for enhanced heat transfer
-
Excellent temperature uniformity and low thermal resistance
-
Customizable channel layout for chip design
-
Scalable and integrable with metal lid structures
VC + MC Lid Hybrid Module
The VC + MC Lid Hybrid Module combines the superior heat spreading of a Vapor Chamber (VC) with the high-efficiency liquid cooling of a Microchannel Lid (MC).
This integrated design shortens the thermal path and enhances heat transfer efficiency, providing superior temperature uniformity and compact thermal management for high-power processors.
The lower Vapor Chamber (VC) effectively eliminates hot spots, rapidly spreading heat and maintaining temperature uniformity. The upper Microchannel Lid (MC) provides liquid cooling over a larger surface area, achieving dual-path heat dissipation, optimized thermal control, and enhanced system integration.
Key Features:
-
Hybrid thermal path: phase change + liquid cooling
-
Tailored for AI accelerators and HPC processors
-
Excellent thermal resistance and uniformity performance
-
Compact, modular design for easy system integration
-
Compatible with 2.5D/3D ICs and high-power chip modules
