IC Socket & Loading Mechanism Module
IC Socket
IC Socket is a critical electromechanical interface between the processor and the system motherboard, providing reliable electrical signal transmission.
Through high-density contact design and high-precision mechanical architecture, IC sockets support high-speed signaling, high current, and large-pin-count packages. They ensure stable connection performance while reducing system assembly and maintenance costs.
IC sockets are widely used in AI/HPC server processors, GPUs, ASICs, FPGAs, memory modules, R&D validation platforms, and semiconductor test equipment—making them an indispensable component in high-performance computing and advanced packaging applications.
Loading Mechanism Module
is the key actuation and force-delivery system between the IC package and the motherboard.
By maintaining uniform loading, optimal contact pressure, and structural coplanarity, the module effectively controls Low-Level Contact Resistance (LLCR), loading force, and assembly warpage, ensuring excellent Signal Integrity (SI), Power Integrity (PI), and Thermo-Mechanical Reliability (TMR).
The LM module can be highly customized according to chip specifications, package type, and thermal requirements. It also supports integration with various cooling solutions to deliver a complete electromechanical and thermal management system.
Key Features:
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Loading Mechanism Module is the key actuation and force-delivery system between the IC package and the motherboard.
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By maintaining uniform loading, optimal contact pressure, and structural coplanarity, the module effectively controls Low-Level Contact Resistance (LLCR), loading force, and assembly warpage, ensuring excellent Signal Integrity (SI), Power Integrity (PI), and Thermo-Mechanical Reliability (TMR).
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The LM module can be highly customized according to chip specifications, package type, and thermal requirements. It also supports integration with various cooling solutions to deliver a complete electromechanical and thermal management system.
