ENGINEERING THE AI CORE
Architecture of Contact Reliability.
The critical infrastructure for high-density computing. Delivering sub-micron precision for the next generation of AI silicon connectivity.
The Backbone of Global AI Infrastructure
Jentech specializes in the critical mechanical interface between silicon and the motherboard. Our solutions provide the extreme structural rigidity and signal integrity required by AI accelerators and high-performance server CPUs.
01 / STRUCTURAL
Loading Mechanisms
Optimized pressure distribution for high pin-count sockets to ensure uniform electrical contact across thousands of points.
02 / INTERFACE
Socket ILM Solutions
Advanced Independent Loading Mechanisms (ILM) designed for extreme thermals and mechanical stress resistance.
03 / FOUNDATION
Bolster & Base Plates
Precision-machined stainless steel and composite bases that prevent PCB warping under high clam
Base plate
Introducing Jentech's high-quality Base Plate solution, designed specifically for optimal performance in clamping modules. Just like a bolster, our Base Plate ensures a stable loading force between your CPU and connector, enhancing data transmission accuracy. It’s a crucial component for anyone seeking reliable and efficient connectivity in their products.
Loading Mechanism
Jentech's Load mechanism is the key actuation and force-delivery system between the IC package and the motherboard.
By maintaining uniform loading, optimal contact pressure, and structural coplanarity, the module effectively controls Low-Level Contact Resistance (LLCR), loading force, and assembly warpage, ensuring excellent Signal Integrity (SI), Power Integrity (PI), and Thermo-Mechanical Reliability (TMR).
The LM module can be highly customized according to chip specifications, package type, and thermal requirements. It also supports integration with various cooling solutions to deliver a complete electromechanical and thermal management system.
IC Socket
IC Socket is a critical electromechanical interface between the processor and the system motherboard, providing reliable electrical signal transmission.
Through high-density contact design and high-precision mechanical architecture, IC sockets support high-speed signaling, high current, and large-pin-count packages. They ensure stable connection performance while reducing system assembly and maintenance costs.
IC sockets are widely used in AI/HPC server processors, GPUs, ASICs, FPGAs, memory modules, R&D validation platforms, and semiconductor test equipment—making them an indispensable component in high-performance computing and advanced packaging applications.
AI-Optimized Thermal Performance
Our simulations integrate fluid dynamics to ensure that loading mechanisms do not impede airflow, a critical factor in AI server racks consuming upwards of 1000W per socket.
